Failure Analysis Fault localization

...what caused it, and how can it be prevented in the future.

FIB Service Focussed Ion Beam Microscopy

is used for material characterization purposes like cross sectioning, but also for chip circuit modification

Material Analysis Characterizing all kinds of materials

We provide a broad range of microscopy techniques


Failure Analysis

... how or why a part has failed

FIB techniques

...modify micro-and nanotechnology

OBIRCH

Fault localization in semiconductors

TEM sample prep.

Site specific TEM lammella's

Photon Emission

where does the current go?

Circuit Edit

Modify your IC before change your mask