Whether it's a phone, laptop, tablet or whatever electronic device it is. We offer a complete teardown as part of our reverse engineering service. Whether you're interested in a Bill of Materials (BOM) or in the process node of a chip we can extract Technology Intelligence from many devices. Get in touch to find out what we can do for you.
Wandering how particular interconnects are build? Looking for Through Silicon Via's (TSV) or copper pillars. We will make them visible using X-ray, High Quality Optical Microscopy and additional SEM microscopy.
For Patent Infringement purpose we can reveal what technology is used in any particular piece of semiconductor or chip.
Our Competitor Analysis service can be really useful for your marketing strategy. Interested how your competitors device is positioned in the marked?
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- Frontside view motherboard
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- Backside view motherboard
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- Exposed die microscopy image
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- RDL layer details Kirin 980
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- Chip marking details of Kirin 980
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- partial view Apple A11
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- Apple A11 backside floorplan image
